Title:
METHOD FOR PRODUCING WAFER
Document Type and Number:
WIPO Patent Application WO/2022/234714
Kind Code:
A1
Abstract:
The present invention is a method for producing a wafer, the method including: pressing the wafer by a holding means and bringing a first main surface of the wafer into contact with a resin; pressing and spreading the resin on the first main surface of the wafer in a state in which a second main surface of the wafer is released from holding by the holding means, by blowing air from the holding means between the holding means and the second main surface while pressing and spreading the resin on the first main surface of the wafer; separating the wafer and the holding means while blowing air; after separation of the wafer and the holding means, curing the resin to obtain a composite body including a flattened resin layer; grinding or polishing the second main surface of the wafer with the composite body being chucked using the flattened resin layer as a reference surface; and grinding or polishing the first main surface of the wafer with the second main surface of the wafer being chucked. The present invention thus provides a method for producing a wafer that makes it possible to produce a wafer that has good warp and a favorable nanotopography.
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Inventors:
TAGA RYO (JP)
Application Number:
PCT/JP2022/009025
Publication Date:
November 10, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; H01L21/683
Foreign References:
| JP2015038919A | 2015-02-26 | |||
| JP2013175647A | 2013-09-05 | |||
| JP2002086352A | 2002-03-26 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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