Title:
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/150435
Kind Code:
A1
Abstract:
Disclosed is a method for producing a wiring board, wherein desmearing is adequately carried out without roughening the surface of an insulating layer.
This production process of a wiring board comprises: a light irradiation step wherein a wiring board material is irradiated with ultraviolet light in an atmosphere containing oxygen, said wiring board material being obtained by laminating an insulating layer (12) on a conductive layer (11), forming a protective layer (13) on the insulating layer (12), and then forming a through hole (via hole) (12a) that penetrates through the insulating layer (12) and the protective layer (13); and a plating step wherein a plating layer (14) formed of a conductive material is formed on the surface of the wiring board material, said surface containing the bottom of the through hole (12a), after separating the protective layer (13) from the wiring board material.
Inventors:
HABU TOMOYUKI (JP)
ENDO SHINICHI (JP)
ENDO SHINICHI (JP)
Application Number:
PCT/JP2017/007438
Publication Date:
September 08, 2017
Filing Date:
February 27, 2017
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
H05K3/42; H05K3/46
Domestic Patent References:
| WO2015093216A1 | 2015-06-25 |
Foreign References:
| JP2002344144A | 2002-11-29 | |||
| JP2004055618A | 2004-02-19 |
Attorney, Agent or Firm:
KONISHI, Kay et al. (JP)
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