Title:
METHOD FOR REALIZING MICROSTRIP CIRCUIT ON SURFACE OF NON-METAL MATERIAL, AND COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/195976
Kind Code:
A1
Abstract:
The present invention relates to a method for realizing a microstrip circuit on the surface of a non-metal material, and a component. In the method of the present invention, the non-metal comprises glass or ceramic. The method comprises: S1, selecting a corresponding area on the surface of the glass or ceramic with respect to a microstrip circuit; S2, covering the corresponding area with a mixture of metal powder and a catalyst by means of a feeding system; and S3, performing laser radiation on the corresponding area to activate the metal powder and form a microstrip circuit metal layer on the corresponding area. According to embodiments, the present invention is simple in manufacturing process and small in pollution in the entire process.
Inventors:
LIU JUN (CN)
Application Number:
PCT/CN2018/082292
Publication Date:
October 17, 2019
Filing Date:
April 09, 2018
Export Citation:
Assignee:
SHENZHEN TRUSTED HUACHENG COMMUNICATION TECH CO LTD (CN)
International Classes:
H05K3/10
Foreign References:
| CN104822223A | 2015-08-05 | |||
| CN106653630A | 2017-05-10 | |||
| CN103813639A | 2014-05-21 | |||
| US20140353005A1 | 2014-12-04 |
Attorney, Agent or Firm:
SHENZHEN REFINED INTELLECTUAL PROPERTY OFFICE (GENERAL PARTNERSHIP) (CN)
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