Title:
METHOD FOR REGENERATING FILM FORMATION STRUCTURE AND REGENERATED FILM FORMATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/250454
Kind Code:
A1
Abstract:
The present invention provides: a method by which a film formation structure is able to be easily regenerated at low cost; and a regenerated film formation structure which is produced by this method. A method for regenerating a film formation structure, which is characterized by comprising: a new film formation layer superposing step wherein a new SiC layer 16 is superposed on a non-active surface 10b that is on the reverse side of an active surface 10a that has been damaged; and an active surface processing step wherein a focus ring 10 is obtained by processing the active surface 10a.
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Inventors:
NAKAMURA MASAKI (JP)
Application Number:
PCT/JP2019/038355
Publication Date:
December 17, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
ADMAP INC (JP)
International Classes:
H01L21/3065
Foreign References:
| JP2011018894A | 2011-01-27 | |||
| JP2004079983A | 2004-03-11 |
Attorney, Agent or Firm:
MURAKAMI Tomokazu (JP)
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