Title:
METHOD FOR REMOVING ADHERING MATERIAL AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/100466
Kind Code:
A1
Abstract:
The present invention provides: a method for removing an adhering material, said method enabling removal of an adhering material, which contains selenium and adheres to the inner surface of a chamber or the inner surface of a pipe that is connected to the chamber, without dismantling the chamber; and a film forming method. According to the present invention, an adhering material, which contains selenium and adheres to at least either the inner surface of a chamber (10) or the inner surface of a discharge pipe (15) that is connected to the chamber (10), is removed by being reacted with a cleaning gas that contains a fluorine-containing compound gas.
Inventors:
TANIMOTO YOSUKE (JP)
Application Number:
PCT/JP2020/041240
Publication Date:
May 27, 2021
Filing Date:
November 04, 2020
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C23C16/44; H01L21/3065; H01L21/314
Domestic Patent References:
| WO2018043446A1 | 2018-03-08 |
Foreign References:
| JP2003218100A | 2003-07-31 | |||
| US20130095601A1 | 2013-04-18 | |||
| JP2010503977A | 2010-02-04 | |||
| JP2016207789A | 2016-12-08 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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