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Patent Searching and Data


Title:
METHOD FOR SEPARATING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2023/068294
Kind Code:
A1
Abstract:
A method for separating a polyimide film according to the present invention comprises: a step for forming a titanium oxide film on a glass supporting substrate; a step for forming a polyimide layer on the titanium oxide film; a step for irradiating the glass supporting substrate with ultraviolet light from the back surface side, the back surface being not provided with the polyimide layer, with use of a surface light source; and a step for separating the polyimide layer from the glass supporting substrate, which has the titanium oxide film. (Meanwhile, in cases where both the skeleton of a tetravalent group derived from a tetracarboxylic acid dianhydride and the skeleton of a divalent group derived from diamine in a polyimide do not contain a bond group, and the polyimide is composed only of benzene rings, the polyimide inevitably has a fluorinated alkyl group.) This method for separating a polyimide film enables easy interfacial debonding between a glass supporting substrate and a polyimide layer without using an expensive laser lift-off apparatus or a wet method such as an immersion method and an etching method.

Inventors:
HASEGAWA MASATOSHI (JP)
ISHII JUNICHI (JP)
EBARA KAZUYA (JP)
Application Number:
PCT/JP2022/038918
Publication Date:
April 27, 2023
Filing Date:
October 19, 2022
Export Citation:
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Assignee:
TOHO UNIV (JP)
NISSAN CHEMICAL CORP (JP)
International Classes:
B29C41/12; B29C41/34; B32B9/00; B32B17/06; B32B27/34; C08G73/10; C08J5/18; H05K3/00
Domestic Patent References:
WO2016167296A12016-10-20
WO2022124394A12022-06-16
Foreign References:
JP2008010515A2008-01-17
JP2007106118A2007-04-26
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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