Title:
METHOD FOR SOLVING SCRATCHES AND BRIGHT LINES IN LARGE-SIZE SILICON WAFERS WHEN MATERIAL LIFTING
Document Type and Number:
WIPO Patent Application WO/2023/040739
Kind Code:
A1
Abstract:
Disclosed is a method for solving scratches and bright lines in large-size silicon wafers when material lifting, comprising the following steps: tooling preparation, crystal rod bonding, material lifting preparation and material lifting. In the present invention, by means of the optimization and adjustment of the material lifting process, the use of hollow plastic plates and the addition of a cutting fluid during the material lifting process, the cutting fluid is wrapped on a cutting gold steel wire, thereby reducing the surface friction of the cutting gold steel wire, increasing the lubricity, and at the same time adjusting the material lifting process. Due to different positions having different adsorption forces, different material feeding speeds are adjusted to thereby avoid scratches on the surface of a silicon wafer caused by the steel wire, which solves the problem of scratches and bright lines appearing on the surface of silicon wafers during the material lifting process of large-sized silicon wafers, thereby ensuring the quality of silicon wafers, avoiding scrapping, and reducing production costs to a certain extent.
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Inventors:
FU MINGQUAN (CN)
ZHU BING (CN)
XU ZHIQUN (CN)
SUN BIN (CN)
ZHU BING (CN)
XU ZHIQUN (CN)
SUN BIN (CN)
Application Number:
PCT/CN2022/117790
Publication Date:
March 23, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
JINWAN GAOJING SOLAR ENERGY TECH CO LTD (CN)
GUANGDONG GOKIN SOLAR ENERGY TECH CO LTD (CN)
GUANGDONG GOKIN SOLAR ENERGY TECH CO LTD (CN)
International Classes:
B28D5/04; B28D7/00; B28D7/04
Foreign References:
| CN113752402A | 2021-12-07 | |||
| CN212578933U | 2021-02-23 | |||
| CN113071011A | 2021-07-06 | |||
| CN214163582U | 2021-09-10 | |||
| CN111015983A | 2020-04-17 | |||
| CN211467022U | 2020-09-11 | |||
| US4955357A | 1990-09-11 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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