METHOD AND STRUCTURE FOR LAYOUT AND ROUTING OF PCB

WIPO Patent Application WO/2019/062209

A1

Disclosed in the present invention are a method and a structure for layout and routing of a PCB. Said method comprises: laying, in a mixed manner, signal wirings, a power supply layer and a ground layer of a PCB; and on a reference layer of the signal wirings, by means of dividing a local region as a ground plane, providing the reference layer and a return path for the signal wirings. Said structure comprises: signal wirings, a power supply layer and a ground layer; on a reference layer of the signal wirings, by means of dividing a local region as a ground plane, providing the reference layer and a return path for the signal wirings. The present invention no longer follows a traditional method in which the signals and power supply are laid in a separated manner. In the present invention, the layout and routing of the signals, the power supply and the ground are in a mixed manner, thereby improving the design density of a board, the layout design region of the power supply, the ground and the signal wiring being reasonably planned, thereby being able to reduce the number of layers of the PCB, and saving cost.

JPS5850793	HIGH HEAT CONDUCTIVE COMPOSITE SINK SUBSTRATE
JP4658772	How to manufacture integrated circuit packages
JPS5763887	PRINTED CIRCUIT BOARD

LI DEHENG (CN)

PCT/CN2018/090980

April 04, 2019

June 13, 2018

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ZHENGZHOU YUNHAI INFORMATION TECH CO LTD (CN)

H05K1/02

CN107592728A	2018-01-16
CN203399401U	2014-01-15
CN105657962A	2016-06-08
US20050039947A1	2005-02-24

UNITALEN ATTORNEYS AT LAW (CN)

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