Title:
METHOD FOR SURFACE-TREATING METAL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/169163
Kind Code:
A1
Abstract:
Provided is a method for surface-treating a metal component, whereby a pseudo-plating layer can be formed on a surface of a metal component, and quality equivalent to plating or another coating treatment can be obtained. The method is characterized in comprising a chemical polishing step (S3) for removing, by chemical polishing, at least 0.5 μm of the surface of a stainless steel base plate formed in a predetermined shape, the chemical polishing step (S3) being followed by a heat-treatment of the base plate in a reducing atmosphere by heating to a solution temperature or higher, for example to 850°C or higher, preferably to about 1040°C, to form a pseudo-plating layer on the surface.
Inventors:
TAMURA TATSUJI (JP)
Application Number:
PCT/JP2012/003630
Publication Date:
December 13, 2012
Filing Date:
June 01, 2012
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
TAMURA TATSUJI (JP)
TAMURA TATSUJI (JP)
International Classes:
C23F17/00; C21D1/76; C23F3/04; C25F3/24; G11B21/21
Foreign References:
| JP3563037B2 | 2004-09-08 | |||
| JPH03180500A | 1991-08-06 |
Attorney, Agent or Firm:
SUDO, Yuichi (JP)
Yuichi Sudo (JP)
Yuichi Sudo (JP)
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Claims: