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Title:
REINFORCING MEMBER, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND FABRICATION METHOD FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/169162
Kind Code:
A1
Abstract:
A reinforcing member (4) is joined to at least one side of a wiring substrate (2) equipped with a substrate (21), a first conductor pattern (221) provided on one side of the substrate (21), and a second conductor pattern (224) provided on the other side of the substrate (21) and electrically connected to the first conductor pattern (221). The reinforcing member (4) has a plate-shaped body (41) with a coefficient of thermal expansion lower than that of the wiring substrate (2), and an adhesion layer (42) that is on one side of the body (41) and that joins the body (41) to the wiring substrate (2).

Inventors:
OKADA RYOICHI (JP)
TACHIBANA KENYA (JP)
ONOZUKA IJI (JP)
HOSOMI TAKESHI (JP)
Application Number:
PCT/JP2012/003627
Publication Date:
December 13, 2012
Filing Date:
June 01, 2012
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
OKADA RYOICHI (JP)
TACHIBANA KENYA (JP)
ONOZUKA IJI (JP)
HOSOMI TAKESHI (JP)
International Classes:
H01L23/12
Foreign References:
JPH09266231A1997-10-07
US5397921A1995-03-14
JPH07221125A1995-08-18
JP2004087789A2004-03-18
JP2009260335A2009-11-05
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
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Claims:



 
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