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Title:
METHOD OF SURFACE TREATMENT FOR THE INHIBITION OF WISKERS
Document Type and Number:
WIPO Patent Application WO/2007/040191
Kind Code:
A1
Abstract:
A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Tl, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.

Inventors:
TSUJIMOTO MASANOBU (JP)
YANADA ISAMU (JP)
SUGANUMA KATSUAKI (JP)
KIM KEUNSOO (JP)
Application Number:
PCT/JP2006/319668
Publication Date:
April 12, 2007
Filing Date:
October 02, 2006
Export Citation:
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Assignee:
UYEMURA C & CO LTD (JP)
UNIV OSAKA (JP)
TSUJIMOTO MASANOBU (JP)
YANADA ISAMU (JP)
SUGANUMA KATSUAKI (JP)
KIM KEUNSOO (JP)
International Classes:
C25D5/10; C25D7/00; H01L23/50; H01R13/03
Foreign References:
JP2003003292A2003-01-08
JPS5935694A1984-02-27
JPS53115623A1978-10-09
JP2002317295A2002-10-31
JP2005154835A2005-06-16
JP2002317295A2002-10-31
JPH10102266A1998-04-21
JP2942476B21999-08-30
JPS5647955A1981-04-30
JPS5647956A1981-04-30
JP2002053981A2002-02-19
JPS63285943A1988-11-22
Other References:
TECHNICAL REPORTS OF MITSUBISHI ELECTRIC CORPORATION, vol. 53, no. 11, 1979
See also references of EP 1932952A4
Attorney, Agent or Firm:
KOJIMA, Takashi (16-12 Ginza 2-chom, Chuo-ku Tokyo 61, JP)
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