Title:
SEMICONDUCTOR CHIP CUTTING METHOD AND SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2007/040190
Kind Code:
A1
Abstract:
A structure material (6) is formed on a silicon substrate (4), and a holding film
(8) is formed on a side of the structure material (6) on the silicon substrate (4).
A through hole (5) reaching the structure material (6) on one side of the silicon
substrate (4) from the other side and a scribe region (3) surrounding the circumference
of the structure material (6) are etched at the same time to cut out a semiconductor
chip (2).
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Inventors:
KIYOMOTO TOMOFUMI (JP)
ONO KATSUYUKI (JP)
HARADA MUNEO (JP)
ONO KATSUYUKI (JP)
HARADA MUNEO (JP)
Application Number:
PCT/JP2006/319667
Publication Date:
April 12, 2007
Filing Date:
October 02, 2006
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
KIYOMOTO TOMOFUMI (JP)
ONO KATSUYUKI (JP)
HARADA MUNEO (JP)
KIYOMOTO TOMOFUMI (JP)
ONO KATSUYUKI (JP)
HARADA MUNEO (JP)
International Classes:
H01L21/301; B81C1/00
Foreign References:
| JPH097975A | 1997-01-10 | |||
| JP2002093752A | 2002-03-29 | |||
| JPH04159712A | 1992-06-02 | |||
| JPH04297056A | 1992-10-21 | |||
| JP2005161516A | 2005-06-23 | |||
| JP2000340527A | 2000-12-08 |
Attorney, Agent or Firm:
ITOH, Hidehiko et al. (Kyowa Shimanouchi Bldg. 21-19, Shimanouchi 1-chome, Chuo-k, Osaka-shi Osaka 82, JP)
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