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Patent Searching and Data


Title:
METHOD AND SYSTEM FOR MEASURING MECHANICAL PROPERTIES OF SMART CARD INSTALLATION STRUCTURE OF COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/055468
Kind Code:
A1
Abstract:
The present disclosure relates to the field of mechanical assembly technology measurement, and provides a method and system for measuring mechanical properties of a smart card installation structure of a communication device, a terminal device, and a product. The method comprises: acquiring a pop-out process video of a card tray pop-out process; on the basis of the pop-out process video, obtaining a time-displacement association relationship of a card tray and a time-displacement association relationship of an ejector pin in the card tray pop-out process; on the basis of the time-displacement association relationship of the card tray, obtaining a critical moment when the card tray reaches a critical point, and according to the time-displacement association relationship of the card tray and the time-displacement association relationship of the ejector pin in the card tray pop-out process, and the rigidity of a pop-out rod, obtaining an ejection force of the ejector pin against the card tray at the critical moment. The method can accurately and precisely measure the mechanical properties of the card tray structure of a smart card, thereby facilitating the determination of a main factor affecting the mechanical properties of the structure.

Inventors:
LIN WEIYAN (CN)
WEI LINYAN (CN)
XIAO LE (CN)
Application Number:
PCT/CN2022/142150
Publication Date:
March 21, 2024
Filing Date:
December 27, 2022
Export Citation:
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Assignee:
WINGTECH MOBILE COMMUNICATIONS CO LTD (CN)
International Classes:
G01L5/00
Domestic Patent References:
WO2014086141A12014-06-12
Foreign References:
CN115468691A2022-12-13
CN105827263A2016-08-03
CN216598231U2022-05-24
CN110416859A2019-11-05
US20170070002A12017-03-09
US4843221A1989-06-27
Attorney, Agent or Firm:
GUANGZHOU DEKE INTELLECTUAL PROPERTY AGENT LTD. (CN)
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