Title:
METHOD FOR TRANSFERRING MICRO FLIP CHIPS
Document Type and Number:
WIPO Patent Application WO/2024/027201
Kind Code:
A1
Abstract:
The present application provides a method for transferring micro flip chips, comprising: providing a driving substrate and a temporary substrate, a plurality of micro flip chips being bonded to one surface of the temporary substrate; forming first bonding members on the surfaces of second electrical connecting members of the micro flip chips facing away from the temporary substrate, the first bonding members being made of a conductive adhesive; transferring the plurality of micro flip chips to the driving substrate, and connecting the second electrical connecting members of the micro flip chips and first electrical connecting members of the driving substrate by means of the first bonding members; testing the plurality of micro flip chips, and determining a defective pixel position of a defective chip on the driving substrate; and irradiating the first bonding member at the defective pixel position with laser, and removing the defective chip. The method can ensure stable bonding of the micro flip chips and the driving substrate, enables original bonding solder joints to continue to be used while preventing the first electrical connecting members from being damaged by laser irradiation, and has high defective chip removal efficiency.
Inventors:
YANG XU (CN)
HUANG KAI (CN)
LI JINCHAI (CN)
ZHANG RONG (CN)
HUANG KAI (CN)
LI JINCHAI (CN)
ZHANG RONG (CN)
Application Number:
PCT/CN2023/088493
Publication Date:
February 08, 2024
Filing Date:
April 14, 2023
Export Citation:
Assignee:
UNIV XIAMEN (CN)
TAN KAH KEE INNOVATION LABORATORY (CN)
TAN KAH KEE INNOVATION LABORATORY (CN)
International Classes:
H01L33/00; H01L25/075; H01L33/48; H01L33/62
Foreign References:
| CN115274942A | 2022-11-01 | |||
| CN111489991A | 2020-08-04 | |||
| CN103295893A | 2013-09-11 | |||
| CN108493154A | 2018-09-04 | |||
| CN110148655A | 2019-08-20 | |||
| JP2021110875A | 2021-08-02 |
Attorney, Agent or Firm:
SUNSHINE INTELLECTUAL PROPERTY INTERNATIONAL CO., LTD. (CN)
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