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Title:
METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING MESA STRUCTURES AND MULTIPLE PASSIVATION LAYERS AND RELATED DEVICES
Document Type and Number:
WIPO Patent Application WO2004059808
Kind Code:
A3
Abstract:
A method of forming a semiconductor device may include forming a semiconductor structure on a substrate wherein the semiconductor structure defines a mesa having a mesa surface opposite the substrate and mesa sidewalls between the mesa surface and the substrate. A first passivation layer can be formed on at least portions of the mesa sidewalls and on the substrate adjacent the mesa sidewalls wherein at least a portion of the mesa surface is free of the first passivation layer and wherein the first passivation layer comprises a first material. A second passivation layer can be formed on the first passivation layer wherein at least a portion of the mesa surface is free of the second passivation layer, and wherein the second passivation layer comprises a second material different than the first material. Related devices are also discussed.

Inventors:
HABERERN KEVIN W (US)
ROSADO RAYMOND (US)
BERGMANN MICHAEL J (US)
EMERSON DAVID T (US)
Application Number:
PCT/US2003/040682
Publication Date:
December 09, 2004
Filing Date:
December 18, 2003
Export Citation:
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Assignee:
CREE INC (US)
HABERERN KEVIN W (US)
ROSADO RAYMOND (US)
BERGMANN MICHAEL J (US)
EMERSON DAVID T (US)
International Classes:
C30B1/00; H01L21/00; H01L33/14; H01S5/042; H01S5/22; H01S5/223; H01S5/323; H01S5/227; (IPC1-7): H01S5/028; H01S5/323
Domestic Patent References:
WO2004047244A12004-06-03
WO2001095446A12001-12-13
Foreign References:
US5208183A1993-05-04
FR2613547A11988-10-07
US6365968B12002-04-02
EP1039600A22000-09-27
US20020159494A12002-10-31
Other References:
KOREN U ET AL: "INGAASP/INP UNDERCUT MESA LASER WITH PLANAR POLYIMIDE PASSIVATION", APPLIED PHYSICS LETTERS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 42, no. 5, March 1983 (1983-03-01), pages 403 - 405, XP000706209, ISSN: 0003-6951
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