Title:
MICRO-ELECTRO-MECHANICAL SYSTEM ENCAPSULATION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/218161
Kind Code:
A1
Abstract:
Provided are a micro-electro-mechanical system encapsulation structure (100) and a method for manufacturing same. The method for manufacturing the micro-electro-mechanical system encapsulation structure (100) comprises the following steps: using a flip chip technique to mount an integrated circuit chip (20) on a surface of a substrate (10); mounting a micro-electro-mechanical system chip (30) on the surface of the integrated circuit chip (20) that faces away from the substrate (10), and making the micro-electro-mechanical system chip (30) be electrically connected to the substrate (10) by means of wire (32) bonding; and dispensing an adhesive into a gap between the integrated circuit chip (20) and the substrate (10), so as to fill the gap, and then performing curing.
Inventors:
HE YOUJING (CN)
FAN WENZHE (CN)
FAN WENZHE (CN)
Application Number:
PCT/CN2020/135038
Publication Date:
November 04, 2021
Filing Date:
December 09, 2020
Export Citation:
Assignee:
QINGDAO GOERTEK MICROELECTRONICS RES INSTITUTE CO LTD (CN)
International Classes:
B81B7/00; B81C1/00
Foreign References:
| CN111498791A | 2020-08-07 | |||
| CN207300479U | 2018-05-01 | |||
| CN107146779A | 2017-09-08 | |||
| CN103426871A | 2013-12-04 | |||
| CN104394496A | 2015-03-04 | |||
| CN210042212U | 2020-02-07 | |||
| CN101316462A | 2008-12-03 | |||
| US20100086164A1 | 2010-04-08 | |||
| US9475691B1 | 2016-10-25 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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