Title:
MICROCHANNEL COOLING DEVICE, MICROCHANNEL COOLING SYSTEM, AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2013/065196
Kind Code:
A1
Abstract:
A heat sink (22) of a microchannel cooling device thermally connected to a heat source has liquid refrigerant flow channels (24) having extremely small cross sections. A thermoelectric element (10) is provided to the heat sink (22). The thermoelectric element (10) extends in a direction parallel to the direction in which the liquid refrigerant flow channels (24) extend.
Inventors:
TSUBOI OSAMU (JP)
KOUMA NORINAO (JP)
MIZUNO YOSHIHIRO (JP)
KOUMA NORINAO (JP)
MIZUNO YOSHIHIRO (JP)
Application Number:
PCT/JP2011/075509
Publication Date:
May 10, 2013
Filing Date:
November 04, 2011
Export Citation:
Assignee:
FUJITSU LTD (JP)
TSUBOI OSAMU (JP)
KOUMA NORINAO (JP)
MIZUNO YOSHIHIRO (JP)
TSUBOI OSAMU (JP)
KOUMA NORINAO (JP)
MIZUNO YOSHIHIRO (JP)
International Classes:
G06F1/20; H01L23/473; H01L23/38
Foreign References:
| JP2008016613A | 2008-01-24 | |||
| JP2007109794A | 2007-04-26 | |||
| JP2006242455A | 2006-09-14 | |||
| JP2009194019A | 2009-08-27 | |||
| JP2004003816A | 2004-01-08 | |||
| JP2001282396A | 2001-10-12 | |||
| JP2003269817A | 2003-09-25 |
Other References:
See also references of EP 2775517A4
Attorney, Agent or Firm:
ITOH, TADAHIKO (JP)
Tadahiko Ito (JP)
Tadahiko Ito (JP)
Download PDF:
Claims:
Previous Patent: FIBER-BUNDLE CUTTING DEVICE AND HOLLOW-FIBER-BUNDLE MANUFACTURING DEVICE
Next Patent: POROUS BODY AND METHOD FOR PRODUCING SAME
Next Patent: POROUS BODY AND METHOD FOR PRODUCING SAME