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Title:
MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND WIRING BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/058835
Kind Code:
A1
Abstract:
A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of the halide ion is 0.005-0.1 moles/L. By bringing the microetching agent into contact with the surface of copper, the copper surface is roughened. An amount of 0.4 µm or less is preferred for the average amount of etching in the depth direction during roughening. This microetching agent is able to impart on copper surfaces a roughened form having excellent adhesiveness to, for example, resins even with low etching amounts.

Inventors:
OGINO YUKI (JP)
SAKAMOTO TAKAHIRO (JP)
URUSHIBATA KAORU (JP)
Application Number:
PCT/JP2018/030714
Publication Date:
March 28, 2019
Filing Date:
August 20, 2018
Export Citation:
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Assignee:
MEC CO LTD (JP)
International Classes:
C23F1/18; H05K3/38
Domestic Patent References:
WO2013187537A12013-12-19
Foreign References:
JP2001200380A2001-07-24
JPH07292483A1995-11-07
JP2014025088A2014-02-06
JP2013211346A2013-10-10
Other References:
See also references of EP 3680363A4
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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