Title:
MICROFLUIDIC CHIP HAVING FLAT DIELECTRIC LAYER SURFACE, PREPARATION METHOD THEREFOR, AND MANUFACTURING MOLD
Document Type and Number:
WIPO Patent Application WO/2023/035289
Kind Code:
A1
Abstract:
A microfluidic chip having a flat dielectric layer (1) surface, comprising a dielectric layer (1) and a circuit layer (2). The side of the dielectric layer (1) on which the circuit layer (2) is not formed is a flat surface. A dielectric layer molding surface (44) is used to flatten the surface of the dielectric layer (1) so as to ensure that the surface of the dielectric layer (1) is flat, thus the product quality of digital microfluidic chips is effectively increased.
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Inventors:
HU QIUBIN (CN)
Application Number:
PCT/CN2021/118384
Publication Date:
March 16, 2023
Filing Date:
September 15, 2021
Export Citation:
Assignee:
SHANGHAI RENXING BIOTECHNOLOGY CO LTD (CN)
International Classes:
B01L3/00
Domestic Patent References:
| WO2019237618A1 | 2019-12-19 |
Foreign References:
| CN108465493A | 2018-08-31 | |||
| CN113211720A | 2021-08-06 | |||
| CN113304791A | 2021-08-27 | |||
| CN112136205A | 2020-12-25 | |||
| CN110653011A | 2020-01-07 | |||
| CN109647549A | 2019-04-19 | |||
| US20180085756A1 | 2018-03-29 | |||
| JP2016153725A | 2016-08-25 | |||
| CN205201976U | 2016-05-04 | |||
| US20160121527A1 | 2016-05-05 | |||
| CN108333745A | 2018-07-27 |
Attorney, Agent or Firm:
XIANGHE IP LAW FIRM (CN)
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