MICRONEEDLE DEVICE SYSTEM - HISAMITSU PHARMACEUTICAL CO

Title:

MICRONEEDLE DEVICE SYSTEM

Document Type and Number:

WIPO Patent Application WO/2016/088886

Kind Code:

A1

Abstract:

A microneedle device system is provided with: a microneedle device in which a plurality of microneedles are formed approximately along the surface of a sheet having one surface that is a skin contact surface and another surface that is a rear surface and in which the microneedles in a skin puncture area of the sheet rise up from the skin contact surface so as to be capable of piercing skin when the sheet is bent in the thickness direction, said microneedle device comprising sheet-like microneedles, an adhesive layer provided to the sheet-like microneedles, and a liner that is detachably attached to the adhesive layer; and an auxiliary tool comprising a bending section that causes the microneedle device to bend in the thickness direction, said auxiliary tool having the microneedle device movably mounted thereto along the bending section.

Inventors:

OGURA MAKOTO (JP)
YAMAMOTO NAOKI (JP)
KUMON TAKASHI (JP)

Application Number:

PCT/JP2015/084193

Publication Date:

June 09, 2016

Filing Date:

December 04, 2015

Export Citation:

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Assignee:

HISAMITSU PHARMACEUTICAL CO (JP)

International Classes:

A61M37/00

Domestic Patent References:

WO2013187392A1

2013-12-19

Foreign References:

JP2014217520A

2014-11-20

Other References: