Title:
MICRONEEDLE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/005176
Kind Code:
A1
Abstract:
The microneedle structure 10 of the present invention is provided with a needle-shaped part 12 having a pore portion 13 formed therein, wherein the needle-shaped part 12 contains a low melting point resin having a weight-average molecular weight of 25,000 or more and a melting point of 130°C or less. Such a microneedle structure can be configured to have a needle-shaped part having high strength.
Inventors:
KOMA YOSUKE (JP)
KABUTO AKIO (JP)
KABUTO AKIO (JP)
Application Number:
PCT/JP2023/024316
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
A61K9/00; A61K8/00; A61M37/00
Domestic Patent References:
| WO2011010605A1 | 2011-01-27 | |||
| WO2006080508A1 | 2006-08-03 |
Foreign References:
| JP2017000724A | 2017-01-05 | |||
| JP2007037885A | 2007-02-15 | |||
| JP2019058712A | 2019-04-18 | |||
| JP2020032211A | 2020-03-05 | |||
| KR102042572B1 | 2019-12-02 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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