Title:
A MINIATURE CONDENSER MICROPHONE AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO2003047307
Kind Code:
A3
Abstract:
An acoustic pressure type sensor (10) fabricated on a supporting substrate (19) is disclosed. The acoustic sensor is fabricated by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm (11) positioned at a distance from an electrically conductive fixed electrode (21). In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.
Inventors:
PEDERSEN MICHAEL (US)
Application Number:
PCT/US2002/037539
Publication Date:
November 27, 2003
Filing Date:
November 25, 2002
Export Citation:
Assignee:
CORP FOR NAT RES INITIATIVES (US)
PEDERSEN MICHAEL (US)
PEDERSEN MICHAEL (US)
International Classes:
H04R19/00; (IPC1-7): H04R25/00; H04R31/00
Foreign References:
| US5452268A | 1995-09-19 | |||
| US20020067663A1 | 2002-06-06 | |||
| US5870482A | 1999-02-09 | |||
| US5677965A | 1997-10-14 | |||
| US5303210A | 1994-04-12 | |||
| US6243474B1 | 2001-06-05 | |||
| US5982709A | 1999-11-09 |
Other References:
RUDOLF F., BERGQUIST J.: "A silicon condenser microphone with a highly perforated backplate", IEEE, 1991, pages 266 - 269, XP010037256
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