Title:
MODIFIED PHENOXY RESIN, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED PRODUCT, AND LAMINATED BOARD FOR ELECTRICAL/ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2022/070921
Kind Code:
A1
Abstract:
The present invention provides: a modified phenoxy resin having excellent dielectric properties and storage stability; a resin composition containing this modified phenoxy resin and a curing agent; a cured product of the resin composition having excellent dielectric properties; and a laminated board for an electrical/electronic circuit. This modified phenoxy resin is represented by formula (1) and has a weight average molecular weight of 10,000-200,000. In the formula, X is a divalent group, Y is an acyl group or a hydrogen atom, and Z is a hydrogen atom or an acyl group, with 5 mol% or more being acyl groups.
Inventors:
AKIBA KEITA (JP)
SATO HIROSHI (JP)
SATO HIROSHI (JP)
Application Number:
PCT/JP2021/033919
Publication Date:
April 07, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G59/14; C08G65/00; C08G65/48; H05K1/03
Domestic Patent References:
| WO2021187180A1 | 2021-09-23 |
Foreign References:
| JP2007277333A | 2007-10-25 | |||
| JP2016089165A | 2016-05-23 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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