Title:
A MODIFIED SILICON DIOXIDE SOL, THE MANUFACTURING METHOD AND USE OF THE SAME
Document Type and Number:
WIPO Patent Application WO/2009/006784
Kind Code:
A1
Abstract:
The invention discloses a modified silicon dioxide sol, manufacturing method
and use of the same, and a polishing liquid containing the same. The surface of
the silicon dioxide of the modified silicon dioxide sol is bonded with epoxy-group-containing
silane coupling agent. Modification is performed after mixing the silicon dioxide
sol, surfactant and epoxy-group-containing silane coupling agent. Among the
modified silicon dioxide sol according to the invention, surfaces of the silicon
dioxide particles are grafted with epoxy groups, and on the one hand it can change
hydrophilicity of the silicon dioxide particles, and on the other hand it can
change the interaction between the silicon dioxide particles and the surfaces
of wafer or polishing pad. Due to the improvement of the two properties, it can
achieve higher polishing rates of TEOS and BD, and can bring less effect on polishing
of Ta and Cu.
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Inventors:
CHEN JERY GUODONG (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
SONG EPHANT CHENGBING (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
SONG EPHANT CHENGBING (CN)
Application Number:
PCT/CN2008/001259
Publication Date:
January 15, 2009
Filing Date:
July 01, 2008
Export Citation:
Assignee:
ANJI MICROELECTRONICS SHANGHAI (CN)
CHEN JERY GUODONG (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
SONG EPHANT CHENGBING (CN)
CHEN JERY GUODONG (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
SONG EPHANT CHENGBING (CN)
International Classes:
C01B33/14; C09C1/28; C09C3/12; C09G1/02; C09K3/14
Foreign References:
| CN1536032A | 2004-10-13 | |||
| US6015843A | 2000-01-18 | |||
| CN1367809A | 2002-09-04 | |||
| CN1692073A | 2005-11-02 | |||
| JPH11343396A | 1999-12-14 | |||
| EP0371147B1 | 1993-05-19 |
Attorney, Agent or Firm:
ZHENGHAN LAW FIRM (South Tower of Shanghai Stock Exchange BuildingNo. 528 Pu Dong Road, Shanghai, CN)
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