Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MODULAR JACK ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2004112201
Kind Code:
B1
Abstract:
A terminal module is provided, such as for use in a modular jack assembly. The module includes a dielectric body having a pair of body halves with opposing faces. A plurality of terminals have mounting portions embedded in the opposing faces of the body halves. The terminals are securely captured in the dielectric body when the mounting portions are sandwiched between the body halves.

Inventors:
HANRAHAN MARK G (US)
PHOMMACHANH CHANSY (US)
ROBERTS JAMES (US)
KIEZULAS JOHN C (US)
Application Number:
US2004017811W
Publication Date:
March 31, 2005
Filing Date:
June 04, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MOLEX INCORPORATED
HANRAHAN, MARK, G.
PHOMMACHANH, CHANSY
ROBERTS, JAMES
KIEZULAS, JOHN, C.
International Classes:
H01R13/502; H01R24/00; H01R13/66; (IPC1-7): H01R24/06; H01R13/504; H01R13/646
Download PDF:



 
Previous Patent: CONNECTOR FOR CARD

Next Patent: TERMINAL CRIMPER