Title:
MODULE COMPONENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS USING THE MODULE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/103756
Kind Code:
A1
Abstract:
A module component is provided with: a circuit board; a component mounted on the upper surface of the circuit board; a sealing section which is arranged on the upper surface of the circuit board and seals the component; a ground pattern arranged on the outer circumferential portion on the lower surface of the circuit board; and a metal film which covers the sealing section and the circuit board. The metal film has: a top surface section which covers the upper surface of the sealing section; a side surface section which extends from the top surface section and covers the side surfaces of the circuit board; and a bottom surface section which extends from the side surface sections and is arranged on the ground pattern. The bottom surface section has a smaller thickness at a further distance from the side section. In the module component, the wiring pattern on the circuit board can be electrically connected with the metal film with high reliability.
Inventors:
IWAMIYA HIROKI
SAKAI YUKIO
SAKAI YUKIO
Application Number:
PCT/JP2010/001496
Publication Date:
September 16, 2010
Filing Date:
March 04, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
IWAMIYA HIROKI
SAKAI YUKIO
IWAMIYA HIROKI
SAKAI YUKIO
International Classes:
H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| WO2007060784A1 | 2007-05-31 |
Foreign References:
| JP2008147572A | 2008-06-26 | |||
| JP2007067407A | 2007-03-15 | |||
| JP2006286915A | 2006-10-19 | |||
| JP2001339016A | 2001-12-07 |
Attorney, Agent or Firm:
NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)
Hiroki Naito (JP)
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