Title:
MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/115358
Kind Code:
A1
Abstract:
This module includes a wiring substrate, and comprises land electrodes and wiring conductors which are arranged on the surface of said wiring substrate and which can be bonded to surface-mounted components with no solder interposed therebetween, allowing the module to be more compact and have a lower profile. This module (10) includes a wiring substrate (12). Land electrode units (16) and wiring conductor units (18) are arranged on one main surface (12a) of the wiring substrate (12). Surface-mounted components (20a, 20b) are bonded to the land electrode units (16) with external electrode units (34, 36) or external terminal units (38, 40) interposed therebetween. The surface-mounted components (20a, 20b) are mounted by the external electrode units (34, 36) or external terminal units (38, 40) of said surface-mounted components (20a, 20b) being bonded to the land electrodes (16) with Sn interposed therebetween.
Inventors:
OTSUBO YOSHIHITO (JP)
SAKAI NORIO (JP)
SAKAI NORIO (JP)
Application Number:
PCT/JP2013/071821
Publication Date:
July 31, 2014
Filing Date:
August 12, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/32; H05K1/18; H05K3/34
Foreign References:
| JP2009158868A | 2009-07-16 | |||
| JP2011200930A | 2011-10-13 | |||
| JP2010258019A | 2010-11-11 |
Attorney, Agent or Firm:
OKADA, MASAHIRO (JP)
Zenkei Okada (JP)
Zenkei Okada (JP)
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