Title:
BONDING DEVICE, AND METHOD FOR DETECTING BREAKAGE IN SEMICONDUCTOR DIE BY BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/115359
Kind Code:
A1
Abstract:
A die bond (100) is provided with: a rear-surface camera (30) for obtaining a complete image that includes an image of the holding surface of a collet (20) for holding a semiconductor die (40), and that also includes an image of the semiconductor die (40) held by the collet (20); and an image processor (80) for processing the image obtained by the rear-surface camera (30). The image processor (80) has: an image-area-defining means for defining the image area of the semiconductor die (40) in the complete image on the basis of a standard image of the semiconductor die (40) and the brightness difference between the image of the holding surface of the collet (20) and the image of the semiconductor die (40); and a breakage detection means for scanning the confines of the image area of the semiconductor die defined by the image-area-defining means, and determining that there is breakage in the semiconductor die when the rate of change in brightness in the scanning direction is at or above a given threshold. This allows the bonding of a broken semiconductor die to be efficiently suppressed and the quality of semiconductor devices produced by the die bond (100) to be improved.
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Inventors:
TOYOKAWA YUYA (JP)
Application Number:
PCT/JP2013/072091
Publication Date:
July 31, 2014
Filing Date:
August 19, 2013
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52; H01L21/60
Foreign References:
| JP2007115851A | 2007-05-10 | |||
| JP2003185590A | 2003-07-03 | |||
| JPS6216538A | 1987-01-24 |
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
Patent business corporation YKI international patent firm (JP)
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