Title:
MODULE, MODULE PRODUCTION METHOD, AND RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2020/184549
Kind Code:
A1
Abstract:
This module is provided with a substrate, components disposed on the substrate, and a sealing material that covers the substrate and the components. There are no gaps between the substrate and the sealing material and between the components and the sealing material. When TA represents the thickness of the sealing material on the component having the greatest height, TB represents the thickness of the sealing material at a corner of said component, d1 represents a distance from an end part where the sealing material comes into contact with the substrate to a location where the thickness of the end part of the sealing material becomes constant, and d2 represents the thickness of the end part of the sealing material at the location where the thickness thereof becomes constant, formulas (1): 100 μm≤TA≤1300 μm, (2): 1≤d2/d1≤11.43, (3): 50 μm≤TB≤500 μm, and (4): d2=TA are satisfied.
More Like This:
Inventors:
FUJIWARA MASAKAZU (JP)
KUME AKIRA (JP)
KAZAMA SHINICHI (JP)
KUME AKIRA (JP)
KAZAMA SHINICHI (JP)
Application Number:
PCT/JP2020/010228
Publication Date:
September 17, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/29; B32B3/24; B32B27/20; B32B27/26; C08J5/16; C08J5/18; C08L63/02; H01L23/31; H01L25/04; H01L25/18
Foreign References:
| JP2012054363A | 2012-03-15 | |||
| JP2008177432A | 2008-07-31 | |||
| JP2015034300A | 2015-02-19 | |||
| JPH0661372A | 1994-03-04 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF: