Title:
MODULE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/195551
Kind Code:
A1
Abstract:
A module 1 has: a substrate 2 serving as a base body on which an electronic circuit 4 is formed; a lead frame 6 which is electrically connected to the electronic circuit 4; a sealing body 9 which seals the substrate 2 and a portion of the lead frame 6; and a stress relaxation part 8 which is interposed between the substrate 2 and the lead frame 6 and which relieves stress acting on the substrate 2.
Inventors:
SAITO KOJI (JP)
Application Number:
PCT/JP2017/015742
Publication Date:
November 16, 2017
Filing Date:
April 19, 2017
Export Citation:
Assignee:
TOKAI RIKA CO LTD (JP)
International Classes:
G01F1/684; H01L23/48
Foreign References:
| JP2009036641A | 2009-02-19 | |||
| JP2004037302A | 2004-02-05 | |||
| JP2004193405A | 2004-07-08 | |||
| JP2016025194A | 2016-02-08 | |||
| US7667306B1 | 2010-02-23 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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