Title:
MODULE USED FOR STACKING THIN PANELS
Document Type and Number:
WIPO Patent Application WO/2013/121461
Kind Code:
A1
Abstract:
The present invention relates to a module used for stacking thin panels (P), the module being provided with a support section (40) that supports a thin panel (P) from below, a load-transmitting section (20) for transmitting the weight of the thin panel (P) in the vertical direction, and a positioning section (22) that positions the thin panel (P) in the horizontal direction. In order to prevent rattling and damaging of the thin panels (P) due to vibrations during transport: the support section (40) has a supporting surface (42) on which the thin panel (P) is placed; the load-transmitting section (20) has an upper section (26) for receiving the module above and a base (28) for transmitting the load to the upper section (26) of the module below; and a lower protruding section (44) is provided, the lower protruding section being capable of facing and contacting the upper surface of the thin panel (P) that is supported by the module below. The lower end of the lower protruding section (44) is positioned below the base (28).
Inventors:
SUEOKA MASAAKI (JP)
Application Number:
PCT/JP2012/001021
Publication Date:
August 22, 2013
Filing Date:
February 16, 2012
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
SUEOKA MASAAKI (JP)
SUEOKA MASAAKI (JP)
International Classes:
B65D57/00; B65D85/48; B65D85/86; H01L31/04
Foreign References:
| JP2012025473A | 2012-02-09 | |||
| JP2009035300A | 2009-02-19 | |||
| JP2010120690A | 2010-06-03 | |||
| JP2011037474A | 2011-02-24 | |||
| JP2011178450A | 2011-09-15 | |||
| JP2000142873A | 2000-05-23 |
Attorney, Agent or Firm:
OKA, KIYOSHI (JP)
岡 潔 (JP)
岡 潔 (JP)
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Claims: