Title:
I/O MODULE
Document Type and Number:
WIPO Patent Application WO/1989/008974
Kind Code:
A1
Abstract:
An I/O module (2) to be connected to a connection portion (29) on a back panel (4) includes a fixing portion (8) holding a printed circuit board that has at the front end thereof a connector portion and an LED display module (6); and a detachable portion (10) holding a terminal plate of a connector structure that couples to the connector portion. The detachable portion (10) is provided with a hinge and a slidable grip, and the fixing portion (8) is provided with a pin. The detachable portion (10) is coupled to the fixing portion (8) by the coupling of hinge and pin. They are separated from each other by pulling the grip.
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Inventors:
INOUE MICHIYA (JP)
YAMAUCHI TAKASHI (JP)
YAMAUCHI TAKASHI (JP)
Application Number:
PCT/JP1989/000221
Publication Date:
September 21, 1989
Filing Date:
March 02, 1989
Export Citation:
Assignee:
FANUC LTD (JP)
International Classes:
G06F1/18; H01R9/22; H01R12/71; H05K7/14; (IPC1-7): H05K7/14; H01R13/633; H05K5/02
Foreign References:
| JP5910784Y | ||||
| JPS57123670A | 1982-08-02 | |||
| JP5126682Y | ||||
| JPS56109287U | 1981-08-24 |
Other References:
See also references of EP 0400150A4
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