Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2020/017547
Kind Code:
A1
Abstract:
This module (1) is provided with: a substrate (10) having a polygonal shape when viewed in a plan view; electronic components (11) and (12) mounted on one main surface (14) of the substrate (10); and side surface electrodes provided on at least two side surfaces among a plurality of side surfaces constituting the polygonal shape of the substrate (10). The substrate (10) is provided with: a conductor film (31) connected to the electronic component (11) and a conductor film (32) connected to the electronic component (12). The conductor film (31) extends to a side surface (41) among the at least two side surfaces and is connected to a side surface electrode (21) provided on the side surface (41). The conductor film (32) extends to a side surface (42) different from the side surface (41) among the at least two side surfaces and is connected to a side surface electrode (22) provided on the side surface (42).
Inventors:
FURUTANI KOJI (JP)
Application Number:
PCT/JP2019/028070
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/04; H01L23/12; H01L23/36; H01L25/18; H05K1/02
Domestic Patent References:
| WO2004010499A1 | 2004-01-29 | |||
| WO2016080333A1 | 2016-05-26 | |||
| WO2016121491A1 | 2016-08-04 |
Foreign References:
| JP2017045932A | 2017-03-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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