Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/131663
Kind Code:
A1
Abstract:
A module (101) comprises: a substrate (1) that has a first surface (1a) and a second surface (1b); a sealing resin (6) that is disposed so as to cover the first surface (1a) and an electronic component (3a); a shielding film (8) that covers the top surface and side surfaces of the sealing resin (6) and the side surfaces of the substrate (1); a lowermost layer ground conductor (21) that is disposed on the second surface (1b); and an inner ground conductor (23) that is located inside the substrate (1) away from the second surface (1b) and is disposed so as to electrically connect to the shielding film (8) at the side surfaces of the substrate (1). When viewed from a direction perpendicular to the second surface (1b), the lowermost layer ground conductor (21) includes parts having different widths, and when the lowermost layer ground conductor (21) and inner ground conductor (23) are viewed, a region in which the inner ground conductor (23) is present is included in a region in which the lowermost layer ground conductor (21) is present.
Inventors:
ODA TETSUYA (JP)
Application Number:
PCT/JP2020/045594
Publication Date:
July 01, 2021
Filing Date:
December 08, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H05K1/02; H05K3/28; H05K9/00
Foreign References:
| US20150179588A1 | 2015-06-25 | |||
| US20170141081A1 | 2017-05-18 | |||
| US20160300799A1 | 2016-10-13 | |||
| JP2010245139A | 2010-10-28 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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