Title:
MOLD CLAMPING DEVICE, SHAPING DEVICE AND SHAPING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/103830
Kind Code:
A1
Abstract:
A mold clamping device (14) according to the present invention is provided with a pressure receiving platen (24), a fixed platen (20), a movable platen (22), a toggle mechanism (28) and a drive device (37). A first position detector (38a) detects the operation load of the movable platen (22) on the basis of the position of a crosshead (26), a pressure detector (35) detects the actual clamping force of a mold (19) and a second position detector (43) detects the actual position of the movable platen (22). A control unit (50) comprises a first correction means that corrects, on the basis of the actual clamping force and a set clamping force, the operation load of the movable platen (22) when performing minute mold opening operations and a second correction means that corrects the operation load of the movable platen (22) when performing minute mold opening operations on the basis of the position and the operation load of the movable platen (22).
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Inventors:
NAGAMI TAKESHI (JP)
ONUMA HIROYUKI (JP)
ONUMA HIROYUKI (JP)
Application Number:
PCT/JP2015/077922
Publication Date:
June 30, 2016
Filing Date:
October 01, 2015
Export Citation:
Assignee:
TOSHIBA MACHINE CO LTD (JP)
International Classes:
B29C45/66; B22D17/26; B29C45/80
Foreign References:
| JP2008143061A | 2008-06-26 | |||
| JP2005254607A | 2005-09-22 | |||
| JP2011240603A | 2011-12-01 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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