Title:
MOLD FOR INJECTION MOLDING
Document Type and Number:
WIPO Patent Application WO/2013/146009
Kind Code:
A1
Abstract:
Provided is a mold for injection molding capable of preventing molten resin contamination, which arises from dead space in the manifold of a hot runner injection molding mold and also of preventing leakage of the molten resin out of the flow channels. The problem is solved by: configuring the manifold from two separable members; forming the flow channels in one of the separate members and fastening the manifold from both directions of the separating members; and disposing the spacers, which hold the manifold inside the metal plates of the stationary mold, in positions corresponding to the flow channels of the manifold.
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Inventors:
SAWADA KAZUTOSHI (JP)
Application Number:
PCT/JP2013/054898
Publication Date:
October 03, 2013
Filing Date:
February 26, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C45/27
Foreign References:
| JP2001198954A | 2001-07-24 | |||
| JPH0597395A | 1993-04-20 | |||
| JP2002172658A | 2002-06-18 | |||
| JP2002011756A | 2002-01-15 | |||
| JP2000006195A | 2000-01-11 | |||
| JP2000167845A | 2000-06-20 | |||
| JP2004160730A | 2004-06-10 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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