MOLD-RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Title:

MOLD-RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2021/044589

Kind Code:

A1

Abstract:

Provided is a mold-release film comprising a base material layer, an adhesive layer, and an electrically conductive layer disposed between the base material layer and the adhesive layer, the mold-release film satisfying (1) and/or (2). (1) The base material layer includes a polyester copolymer including a butylene structure and an alkylene oxide structure. (2) The rate of elongation at 150℃ is more than or equal to 1000%.

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Inventors:

SERI YASUHIRO (JP)

Application Number:

PCT/JP2019/035010

Publication Date:

March 11, 2021

Filing Date:

September 05, 2019

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

H01L21/56; B29C33/68

Domestic Patent References:

WO2016125796A1	2016-08-11
WO2015133634A1	2015-09-11

Foreign References:

JP2014113703A

2014-06-26

Other References:

ISHIHARA, HIDEAKI ET AL.: "Structure and Properties of Poly(butylene terephthalate)/Thermoplastic Polyester-Based Elastomer Blends", SEIKEI-KAKOU, vol. 24, no. 11, 2012, pages 651 - 659

Attorney, Agent or Firm:

TAIYO, NAKAJIMA & KATO (JP)

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