Title:
MOLD RELEASE FILM AND METHOD FOR MANUFACTURING MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/085363
Kind Code:
A1
Abstract:
This mold release film 10 fulfills condition a. Condition a: A copper foil and the mold release film 10 are stacked and treated at 175°C and 2 MPa for 150 s, then the copper foil and the mold release film 10 are separated. Formula (1) is fulfilled when the surface free energy of the surface on the side that the untreated copper foil and mold release film 10 are stacked is SC1 [mJ/m2] and the surface free energy of the surface on the side on which the treated copper foil and the mold release film 10 are separated is SC2 [mJ/m2]. Formula (1): SC1 – SC2 ≤ 1.7 [mJ/m2]
Inventors:
YAMATO HAJIME (JP)
Application Number:
PCT/JP2021/035006
Publication Date:
April 28, 2022
Filing Date:
September 24, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B29C33/68; B29C43/18; B29C48/08; B29C48/90; B29C59/04; B32B27/00; H05K1/03
Foreign References:
| JP2008246882A | 2008-10-16 | |||
| JP2018178106A | 2018-11-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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