Title:
MOLD RELEASE FILM AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/068807
Kind Code:
A1
Abstract:
Provided are: a mold release film, which has excellent mold release characteristics and suppresses contamination of a resin-sealed section and a molding die due to the mold release film at the time of sealing a semiconductor element using a curable resin, and furthermore, which is capable of forming the resin-sealed section having excellent adhesiveness to an ink layer; and a semiconductor package manufacturing method using the mold release film.
This mold release film is to be disposed on a cavity surface of a molding die in a semiconductor package manufacturing method, wherein a semiconductor element is disposed in the molding die, and a resin-sealed section is formed by sealing the semiconductor element using a curable resin. The mold release film is characterized in that: the mold release film has a first surface in contact with the curable resin at the time of forming the resin-sealed section, and a second surface in contact with the cavity surface; at least the first surface is formed of a fluorine resin; and in a predetermined test method, a value of F/Al is 0.2-4 or a value of F/(C+F+O) is 0.1-0.3.
Inventors:
KASAI WATARU (JP)
SUZUKI MASAMI (JP)
SUZUKI MASAMI (JP)
Application Number:
PCT/JP2014/079591
Publication Date:
May 14, 2015
Filing Date:
November 07, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B29C33/68; C08F214/26; H01L21/56
Domestic Patent References:
| WO2013115187A1 | 2013-08-08 |
Foreign References:
| JP2011044565A | 2011-03-03 | |||
| JP2000252309A | 2000-09-14 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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