Title:
MOLD RELEASE FILM AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/068808
Kind Code:
A1
Abstract:
Provided are: a mold release film wherein wrinkles and pinholes are not easily generated at the time of being adhered to a cavity surface of a molding die, even if the thickness of the mold release film is small; a mold release film whereby a resin-sealed section can be formed, said resin-sealed section not easily generating chipping and breakage in a singulation step, and having excellent adhesiveness to an ink layer; and a semiconductor package manufacturing method using the mold release film.
This mold release film is to be disposed on a cavity surface of a molding die in a semiconductor package manufacturing method wherein a semiconductor element is disposed in a molding die, and a resin-sealed section is formed by sealing the semiconductor element using a curable resin. The mold release film is characterized in that: the mold release film has a first surface in contact with the curable resin at the time of forming the resin-sealed section, and a second surface in contact with the cavity surface; recesses and projections are formed in the first surface and/or the second surface; and the surface having the recesses and projections formed therein has an arithmetic average roughness (Ra) of 1.3-2.5 μm, and a peak count (RPc) of 80-200.
Inventors:
KASAI WATARU (JP)
SUZUKI MASAMI (JP)
SUZUKI MASAMI (JP)
Application Number:
PCT/JP2014/079592
Publication Date:
May 14, 2015
Filing Date:
November 07, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B29C33/68; B29C43/18; B29C48/08; B29C48/305; B32B27/00; B32B27/30; H01L21/56; H01L23/00; B29L31/34
Domestic Patent References:
| WO2008020543A1 | 2008-02-21 |
Foreign References:
| JP2012020429A | 2012-02-02 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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