Title:
MOLD RELEASING FILM AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/179655
Kind Code:
A1
Abstract:
Provided is a mold releasing film capable of favorably preventing a break thereof due to the spread of an end side of a cushion layer. A mold releasing film 30 used when laminating a cover film 20 onto a base laminated body 10 having an insulating resin layer 11 and a pattern layer 12 is provided with: a base layer 31 that is mainly composed of a polyester-based resin; a cushion layer 33 that is mainly composed of an olefin-based resin and that, by means of heating and pressurization, follows irregularities of the cover film 20 and the base laminated body 10 while covering the cover film 20; and an adhesive layer 32 that attaches the cushion layer 33 to the base layer 31 and includes a trap part 34 exposed to protrude from an end side of the cushion layer 33.
Inventors:
TANAKA HIDEAKI (JP)
TANIKAWA YUTO (JP)
YASUDA SHOJI (JP)
HIRATSUKA KIYOSHI (JP)
NAKASHIMA MASASHI (JP)
TANIKAWA YUTO (JP)
YASUDA SHOJI (JP)
HIRATSUKA KIYOSHI (JP)
NAKASHIMA MASASHI (JP)
Application Number:
PCT/JP2017/047063
Publication Date:
October 04, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
NIPPON MEKTRON KK (JP)
International Classes:
B29C63/02; B29C33/68; B32B27/00; H05K3/46
Domestic Patent References:
| WO2005002850A1 | 2005-01-13 | |||
| WO2008001682A1 | 2008-01-03 |
Foreign References:
| JPH02175247A | 1990-07-06 | |||
| JPH0489340U | 1992-08-04 | |||
| JP2015083379A | 2015-04-30 | |||
| JP2010098075A | 2010-04-30 | |||
| JPH0433855A | 1992-02-05 | |||
| JPS59100588A | 1984-06-09 | |||
| JP2005212453A | 2005-08-11 | |||
| JP2003313313A | 2003-11-06 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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