Title:
MOLD, RESIN MOLDING DEVICE, AND METHOD FOR PRODUCING MOLDED RESIN PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/070035
Kind Code:
A1
Abstract:
Provided is a mold capable of preventing a substrate from falling from an upper mold even when warpage of the substrate occurs. This mold for molding resin through compression molding comprises: an upper mold in which a plurality of substrate suction holes for sucking a substrate and a plurality of film suction holes for sucking a release film are formed so as to open on a lower surface of the upper mold; a lower mold disposed below the upper mold in the vertical direction; and a plurality of pushing members provided to the upper mold such that the pushing members can move up and down, and a lower end part thereof can protrude downwardly from the lower surface of the upper mold.
Inventors:
OKAJIMA SEITARO (JP)
OBA AKITO (JP)
OBA AKITO (JP)
Application Number:
PCT/JP2023/018236
Publication Date:
April 04, 2024
Filing Date:
May 16, 2023
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C43/36
Foreign References:
| JP2001203227A | 2001-07-27 | |||
| JP2011046017A | 2011-03-10 | |||
| JP2016107479A | 2016-06-20 |
Attorney, Agent or Firm:
MIKAMI Yoko (JP)
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