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Patent Searching and Data


Title:
MOLDED FOAM RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/104506
Kind Code:
A1
Abstract:
The present invention obtains a molded foam resin article in which an outer cover material is resistant to peeling. This molded foam resin article 1 has a plate-shaped body 4 made of a foam resin, and an outer cover material 6 that is bonded to at least one surface of the plate-shaped body 4. The outer cover material 6 comprises an outer cover material body 61 made of fibers, and a latex material layer 62 that fixes the fibers. The latex material layer 62 is bonded to the plate-shaped body 4, and bubbles in the foam resin forming the plate-shaped body 4 have an average bubble diameter of 150 µm or less in the thickness direction of the plate-shaped body 4.

Inventors:
ONODERA MASAAKI (JP)
YOKOTA KEN (JP)
Application Number:
PCT/JP2015/085840
Publication Date:
June 30, 2016
Filing Date:
December 22, 2015
Export Citation:
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Assignee:
KYORAKU CO LTD (JP)
International Classes:
B32B5/24; B29C51/08; B29C51/12
Domestic Patent References:
WO2006043703A12006-04-27
Foreign References:
JP2004330711A2004-11-25
JP2007301774A2007-11-22
JP2000094620A2000-04-04
JP2006315213A2006-11-24
Attorney, Agent or Firm:
MARUYAMA, TAKAO (JP)
Takao Maruyama (JP)
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