Title:
MOLDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/156917
Kind Code:
A1
Abstract:
In order to achieve lower costs in a molding apparatus using a mold by reducing mold cleaning steps following releasing of the product from the mold and shortening the molding cycle, the apparatus is equipped with a plurality of fixed molds (1) and movable molds (2) which are heated to the temperature necessary to harden a molding material and come together by means of clamping to form a cavity (C), and a non-heated cold runner (32) which supplies the molding material from an injection device (4) to the interior of the cavity (C) via a gate (22) opened in the movable mold (2), the fixed molds (1) and movable molds (2) being movable between an injection stage (S1) where the injection device (4) and cold runner (32) are present and an opening stage (S2) near the injection stage (S1).
Inventors:
KOGA SHOTARO (JP)
URAKAWA TETSUYA (JP)
MASAKA TAKESHI (JP)
KURANO YOSHIHIRO (JP)
WATANABE SHIGERU (JP)
SHIMAZOE TOSHIHIRO (JP)
URAKAWA TETSUYA (JP)
MASAKA TAKESHI (JP)
KURANO YOSHIHIRO (JP)
WATANABE SHIGERU (JP)
SHIMAZOE TOSHIHIRO (JP)
Application Number:
PCT/JP2014/057654
Publication Date:
October 02, 2014
Filing Date:
March 20, 2014
Export Citation:
Assignee:
NOK CORP (JP)
International Classes:
B29C45/04; B29C33/34
Foreign References:
| JPS6143019U | 1986-03-20 | |||
| JPS615909A | 1986-01-11 | |||
| JPS52977B1 | 1977-01-11 | |||
| JPH06106557A | 1994-04-19 | |||
| JP2004345328A | 2004-12-09 | |||
| JP2005081677A | 2005-03-31 | |||
| JPH05200778A | 1993-08-10 | |||
| JP2002273769A | 2002-09-25 | |||
| JPH1134126A | 1999-02-09 |
Other References:
See also references of EP 2979835A4
Attorney, Agent or Firm:
NOMOTO Yoichi et al. (JP)
Yoichi Nomoto (JP)
Yoichi Nomoto (JP)
Download PDF: