Title:
NIOBIUM SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2014/156918
Kind Code:
A1
Abstract:
Provided is a niobium sputtering target that is characterized by containing 5-100 wt ppm of tungsten, by having a purity of 99.995% excluding tungsten, tantalum, and a gas component, and by the average crystal grain size being 150 µm or less. The present invention addresses the problem of providing a niobium sputtering target that has a uniform microstructure, in which plasma is stable, and that makes it possible to improve the uniformity of film thickness.
Inventors:
HARADA KENTARO (JP)
OHASHI KAZUMASA (JP)
OHASHI KAZUMASA (JP)
Application Number:
PCT/JP2014/057659
Publication Date:
October 02, 2014
Filing Date:
March 20, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C14/34; H01L21/285
Foreign References:
| JP2004511651A | 2004-04-15 | |||
| JP2005097696A | 2005-04-14 | |||
| JP2004183040A | 2004-07-02 |
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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