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Patent Searching and Data


Title:
MOLDING BASE MATERIAL, MOLDED PRODUCT USING SAME, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/071141
Kind Code:
A1
Abstract:
Provided are: a molding base material characterized by having at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained by using the same; and a production method therefor. The present invention makes it possible to achieve high thermal resistance and insulation properties as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.

Inventors:
MITSUOKA HIDETO (JP)
KIYAMA HIROSHI (JP)
KIMOTO YUKITANE (JP)
MACHIDA HIDEAKI (JP)
OKUI MASAKAZU (JP)
Application Number:
PCT/JP2021/035148
Publication Date:
April 07, 2022
Filing Date:
September 24, 2021
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
DU PONT TORAY CO LTD (JP)
International Classes:
B32B5/28; B29B11/16; B29C70/16; B32B15/08; B32B27/34; B29K105/06; B29L9/00
Foreign References:
JPS5656851A1981-05-19
JPH0834095A1996-02-06
JPH08276525A1996-10-22
JP2015143343A2015-08-06
JP6580643B22019-09-25
JP2002018993A2002-01-22
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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