Title:
MOLDING CIRCUIT COMPONENT AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/032260
Kind Code:
A1
Abstract:
The range of selection of the material for a primary substrate and the material
for a resin mask in a secondary substrate can be broadened, and short circuiting
of a circuit can be reliably prevented. The shape of a primary substrate (1) is
such that a circuit forming face (11) is in a convex form and a circuit non-forming
face (12) is in a concave form, the difference in level between the circuit forming
face (11) and the circuit non-forming face (12) is 0.05 mm, and the angle of side
walls (13, 14) connecting the circuit forming face to the circuit non-forming
face is 90º. In order to apply a catalyst, a palladium catalyst solution
was immersed in a bath having a water depth of 500 mm at a liquid temperature of 40ºC
for 5 min. Thereafter, a resin mask (3) is dissolved and removed, followed by electroless
plating. As a result, the catalyst solution penetrates up to a part in which the
creeping distance could have been increased, that is, up to both side walls (13,
14). That is, the catalyst penetration can be prevented, and short circuiting
between conductive layers (50), that is, between circuits, can be prevented.
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Inventors:
YOSHIZAWA NORIO (JP)
WATANABE HIROAKI (JP)
WATANABE HIROAKI (JP)
Application Number:
PCT/JP2006/317813
Publication Date:
March 22, 2007
Filing Date:
September 08, 2006
Export Citation:
Assignee:
SANKYO KASEI KK (JP)
YOSHIZAWA NORIO (JP)
WATANABE HIROAKI (JP)
YOSHIZAWA NORIO (JP)
WATANABE HIROAKI (JP)
International Classes:
H05K3/18; B29C69/00; H05K3/00
Foreign References:
| JPH10190193A | 1998-07-21 | |||
| JP2001077512A | 2001-03-23 | |||
| JPH0864933A | 1996-03-08 | |||
| JP2001244610A | 2001-09-07 | |||
| JP3616488B2 | 2005-02-02 |
Other References:
See also references of EP 1926358A4
Attorney, Agent or Firm:
SHIMOSAKA, Sumiko et al. (14-1 Toranomon 1-chome Minato-ku, Tokyo, JP)
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