Title:
MOLDING DEVICE, MOLDING DEVICE UNIT, AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/061457
Kind Code:
A1
Abstract:
A molding device (1) is provided with: a servomotor (11) which moves an upper mold (MU) toward a lower mold (ML) and causes the upper mold (MU) to press on a resin part (W); servomotors (12a, 13a) which maintain the X-Y coordinate position of the lower mold (ML); and a position detection unit (41) which determines the cure of the resin part within the upper and lower molds. When the resin part is cured, the servomotors stop maintaining the position of the lower mold (ML). As a result, a molded product is obtained while preventing the displacement of position caused by a reduction in volume occurring when the resin cures.
Inventors:
NAKAHASHI TAKAHIRO
HANATO HIROYUKI
HANATO HIROYUKI
Application Number:
PCT/JP2013/076934
Publication Date:
April 24, 2014
Filing Date:
October 03, 2013
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
B29C43/54; B29C39/02; B29C39/40; B29C39/44; B29C43/02; B29C43/58; B29K101/10
Foreign References:
| JP2012153080A | 2012-08-16 | |||
| JP2007260791A | 2007-10-11 | |||
| JPH04179517A | 1992-06-26 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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