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Patent Searching and Data


Title:
MOLDING DIE, MOLDED PRODUCT PRODUCTION DEVICE, AND MOLDED PRODUCT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/056614
Kind Code:
A1
Abstract:
According to the present invention, a molding die, a molded product production device, and a molded product production method which are capable of shortening heating time of a cavity and improving production efficiency are obtained. The present invention is provided with: a first die (13) and a second die (14), that is, a pair of dies, each having an abutting surface; a first die part (11) and a second die part (12), each of which having cavity forming sections (11A, 12A) having a cavity (110) formed therein and thick wall sections (11B, 12B) provided at both ends of said cavity forming sections (11A, 12A), which detachably fit into die part mounting grooves (13b, 14b) provided to each of the abutting surfaces (13a, 14a) of the pair of dies; and an induction heating coil (81) for heating the surface (110a) of the cavity (110). The cavity forming sections (11A, 12A) are made thinner than the thick wall sections (11B, 12B), and the distance between the induction heating coil (81) and the cavity (110) is made smaller than the thick wall sections.

Inventors:
OGAWA MIZUKI (JP)
KANETO YOSHINORI (JP)
SAITO KOJI (JP)
TANAKA SHIGEYUKI (JP)
IMAIZUMI MASARU (JP)
Application Number:
PCT/JP2016/069734
Publication Date:
April 06, 2017
Filing Date:
July 04, 2016
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B29C45/73; B29C45/04; B29C45/26
Foreign References:
JP2002283355A2002-10-03
JPH11268095A1999-10-05
JPS57118811U1982-07-23
Other References:
See also references of EP 3357666A4
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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