Title:
MOLDING, METHOD OF PRODUCING MOLDING, AND DEVICE FOR PRODUCING MOLDING
Document Type and Number:
WIPO Patent Application WO/2006/095807
Kind Code:
A1
Abstract:
A lamp body (1) is formed by performing secondary injection of a resin material (6) into the butted part between a lamp main body (2) and a lens portion (3). A groove-like, die receiving portion (2d), into which a die surface enters in order to receive injection force in the secondary injection, is formed inside a butting portion (2c) of the lamp main body (2). When the lamp main body (2) is pushed out by the butting part (2c) to take it out independently, the groove at the die receiving portion (2d) is prevented from being deformed when the groove receives a load in the pushing out operation. A reinforcing rib (2e) filling the die receiving portion (2d) is formed at that part of the butting portion (2c) which corresponds to the part pushed out by a push-out member. By this construction, the die receiving portion is prevented from being deformed by a push-out load when the lamp main body (2) is taken out independently.
Inventors:
UMEZAWA TAKAO (JP)
Application Number:
PCT/JP2006/304576
Publication Date:
September 14, 2006
Filing Date:
March 09, 2006
Export Citation:
Assignee:
OSHIMA ELECTRIC WORKS CO LTD (JP)
UMEZAWA TAKAO (JP)
UMEZAWA TAKAO (JP)
International Classes:
B29C45/16; B29C45/26; B29L9/00; F21Y101/00
Foreign References:
| JP2003291187A | 2003-10-14 | |||
| JP2002113741A | 2002-04-16 | |||
| JPS5265572A | 1977-05-31 | |||
| JPH11300761A | 1999-11-02 | |||
| JP2003039442A | 2003-02-13 | |||
| JPH0752167A | 1995-02-28 | |||
| JPS62130817A | 1987-06-13 | |||
| JP2003109412A | 2003-04-11 |
Attorney, Agent or Firm:
Hirose, Tetsuo (5th Floor 2-5-6, Nishikand, Chiyoda-ku Tokyo 65, JP)
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